According to a new report from China, Qualcomm will announce more details on the upcoming Snapdragon 820 SoC on August 11 at a special press conference in Las Vegas.

It's no news by now that the Qualcomm Snapdragon 810 was plagued by poor thermal performance. Its overheating woes have affected numerous smartphones, with many potential customers avoiding handsets such as the HTC One M9 or the Sony Xperia Z3+ specifically because of reports of overheating or severe throttling. In fact, Qualcomm itself has been affected by the poor financial performance of the Snapdragon 810, and has recently announced that it is forced to let go of 15% of its employees. In this context, it's fairly obvious that #Qualcomm has a lot going on its upcoming high-end chipset, the Snapdragon 820.

Back in March at MWC 2015, #Qualcomm officially announced the #Snapdragon 820, but the information that the company announced at the time was limited to naming a custom 64-bit CPU core called Kyro and the fact that the chip will be manufactured using the non-planar FinFET architecture.

While #Qualcomm has yet to officially publish the technical specifications of the Snapdragon 820, rumors and leaks suggest that the chip will come with a dual-cluster quad-core CPU, with two cores running at 1.7GHz and two cores clocked a bit higher, at 2.2GHz. Other rumored specs include an Adreno 530 GPU clocked at 650MHz, support for #LPDDR4 RAM, and integrated LTE Cat. 10 connectivity. Head over to our rumor roundup for a complete analysis of everything we know about the Snapdragon 820. If this recent report from China turns out to be accurate, then it won't be long before #Qualcomm officially unveils the complete specification set for the #Snapdragon 820.